Title:
PHOTOSENSITIVE ADHESIVE COMPOSITION, PHOTOSENSITIVE ADHESIVE SHEET, AND SEMICONDUCTOR DEVICES USING SAME
Document Type and Number:
WIPO Patent Application WO/2011/049011
Kind Code:
A1
Abstract:
A photosensitive adhesive composition which comprises (A) an epoxy compound, (B) a soluble polyimide that contains residues of a diamine represented by general formula (2), (C) a photopolymerizable compound, and (D) a photopolymerization initiator, wherein the epoxy compound (A) contains an epoxy compound represented by general formula (1) and the soluble polyimide (B) contains residues of a diamine represented by general formula (2).
In general formula (1), m and n are integers of 0 or larger that satisfy the relationship: 1 ≤ m+n ≤ 10; and x is an integer of 1 to 5, and y is an integer of 1 to 10, with x and y satisfying the relationship: y = 2x.
In general formula (2), R1 to R8 may be the same or different from each other and are each selected from the group consisting of hydrogen atom, C1-30 alkyl, C1-30 alkoxy, halogen, sulfone group, nitro, and cyano.
The photosensitive adhesive composition can be developed after light exposure by means of an alkali developer, exhibits high bond strength when applied to a substrate by thermocompression, and ensures excellent insulation reliability.
Inventors:
SHIMADA AKIRA (JP)
TACHIBANA YASUKO (JP)
NIWA HIROYUKI (JP)
NONAKA TOSHIHISA (JP)
TACHIBANA YASUKO (JP)
NIWA HIROYUKI (JP)
NONAKA TOSHIHISA (JP)
Application Number:
PCT/JP2010/068133
Publication Date:
April 28, 2011
Filing Date:
October 15, 2010
Export Citation:
Assignee:
TORAY INDUSTRIES (JP)
SHIMADA AKIRA (JP)
TACHIBANA YASUKO (JP)
NIWA HIROYUKI (JP)
NONAKA TOSHIHISA (JP)
SHIMADA AKIRA (JP)
TACHIBANA YASUKO (JP)
NIWA HIROYUKI (JP)
NONAKA TOSHIHISA (JP)
International Classes:
C09J163/02; C09J4/02; C09J7/10; C09J7/30; C09J11/00; C09J179/08; H01L21/52
Domestic Patent References:
| WO2008149625A1 | 2008-12-11 | |||
| WO2008123507A1 | 2008-10-16 |
Foreign References:
| JP2008133423A | 2008-06-12 | |||
| JP2009021562A | 2009-01-29 | |||
| JP2009194054A | 2009-08-27 | |||
| JP2009221453A | 2009-10-01 | |||
| JP2005290215A | 2005-10-20 | |||
| JP2002278143A | 2002-09-27 | |||
| JP2008286877A | 2008-11-27 | |||
| JPH04337380A | 1992-11-25 | |||
| JP2008281597A | 2008-11-20 | |||
| JP2008088403A | 2008-04-17 | |||
| JP2009221453A | 2009-10-01 |
Other References:
See also references of EP 2492331A4
Download PDF: