Title:
PHOTOSENSITIVE COMPOSITION, CURED PRODUCT, AND METHOD FOR PRODUCING PATTERNED CURED FILM
Document Type and Number:
WIPO Patent Application WO/2023/127402
Kind Code:
A1
Abstract:
Provided are: a photosensitive composition which can form a cured product that is finely patterned and exhibits excellent adhesion to a substrate even if heat treated at a low temperature; a cured product of said photosensitive composition; and a method for producing a patterned cured film using the photosensitive composition. This photosensitive composition contains an alkali-soluble resin (A), a photopolymerization initiator (C) and a silane coupling agent (D). The alkali-soluble resin (A) contains a product of a reaction between: a compound (A-1) having a specific structure having a carboxyl group; and an epoxy compound (A-2) which contains a cyclic structure other than an oxirane ring and has 3 or more epoxy group-containing groups bonded to the cyclic structure. The silane coupling agent (D) contains a silane coupling agent (D1) having a radical-polymerizable group-containing group.
Inventors:
HIKIDA JIRO (JP)
FURUYA KAZUYUKI (JP)
FURUYA KAZUYUKI (JP)
Application Number:
PCT/JP2022/044585
Publication Date:
July 06, 2023
Filing Date:
December 02, 2022
Export Citation:
Assignee:
TOKYO OHKA KOGYO CO LTD (JP)
International Classes:
G03F7/075; C08F290/14; C08G59/32; G03F7/027; G03F7/20
Domestic Patent References:
| WO2018051940A1 | 2018-03-22 |
Foreign References:
| JP2003089716A | 2003-03-28 | |||
| JP2014201710A | 2014-10-27 | |||
| JP2007183495A | 2007-07-19 | |||
| JP2012241083A | 2012-12-10 |
Attorney, Agent or Firm:
SHOBAYASHI Masayuki et al. (JP)
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