Title:
PHOTOSENSITIVE CURABLE COMPOSITION, DRY FILM, CURED PRODUCT, AND ELECTRONIC COMPONENT
Document Type and Number:
WIPO Patent Application WO/2021/053773
Kind Code:
A1
Abstract:
The present invention addresses the problem of providing: a photosensitive curable composition that has superior heat resistance (high Tg) and dielectric properties (low permittivity and low dielectric tangent), and can be patterned by photolithography; a dry film comprising a composition layer obtained from said composition; a cured product of the composition or the composition layer of the dry film; and an electronic component comprising the cured product. The means for solving this problem is a photosensitive curable composition characterized by containing (A) a compound comprising a carbodiimide group, and (B) a compound that generates carboxyl groups and/or phenolic hydroxy groups when irradiated with light.
Inventors:
HAYASHI MAKOTO (JP)
Application Number:
PCT/JP2019/036648
Publication Date:
March 25, 2021
Filing Date:
September 18, 2019
Export Citation:
Assignee:
TAIYO HOLDINGS CO LTD (JP)
International Classes:
C08G73/06; C09D7/63; C09D175/04; G03F7/004; G03F7/022; G03F7/20
Foreign References:
| JPH08314141A | 1996-11-29 | |||
| JP2001345537A | 2001-12-14 | |||
| JP2009222923A | 2009-10-01 | |||
| JPH04217250A | 1992-08-07 |
Attorney, Agent or Firm:
SUGIMURA Kenji (JP)
Download PDF: