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Title:
PHOTOSENSITIVE ELEMENT AND FORMATION METHOD FOR RESIST PATTERN
Document Type and Number:
WIPO Patent Application WO/2023/238202
Kind Code:
A1
Abstract:
This photosensitive element comprises a support body and a photosensitive layer formed on the support body using a photosensitive resin composition containing a binder polymer, a photopolymerizable compound, a photopolymerization initiator, and a coumarin sensitizer, the thickness of the photosensitive layer being 30 μm or greater.

Inventors:
HIRAMATSU NAOKI (JP)
Application Number:
PCT/JP2022/022830
Publication Date:
December 14, 2023
Filing Date:
June 06, 2022
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Assignee:
RESONAC CORP (JP)
International Classes:
G03F7/004
Domestic Patent References:
WO2010126006A12010-11-04
WO2019188378A12019-10-03
Foreign References:
JP2019113690A2019-07-11
JP2005128412A2005-05-19
JP2002287349A2002-10-03
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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