Title:
PHOTOSENSITIVE ELEMENT, METHOD FOR FORMING RESIST PATTERN USING THE SAME, AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD
Document Type and Number:
WIPO Patent Application WO/2010/013623
Kind Code:
A1
Abstract:
Disclosed is a photosensitive element comprising a support film and a photosensitive layer formed on the support film and composed of a photosensitive resin composition. The photosensitive layer contains (A) a binder polymer, (B) a photopolymerizable compound having an ethylenically unsaturated bond and (C) a photopolymerization initiator. A compound represented by general formula (I) and a compound represented by general formula (II) are contained as (B) the photopolymerizable compound having an ethylenically unsaturated bond. (In formulae (I) and (II), R1-R6 independently represent a hydrogen atom or a methyl group; X and Y each represents an alkylene group having 2-6 carbon atoms; m1, m2, m3 and m4 each represents an integer of 0-40, with m1 + m2 + m3 + m4 being 1-40; and n1 and n2 each represents a positive integer, with n1 + n2 being 4-40.)
Inventors:
KUBOTA MASAO (JP)
TAKANO SHINJI (JP)
YAMADA EIICHIROU (JP)
TAKANO SHINJI (JP)
YAMADA EIICHIROU (JP)
Application Number:
PCT/JP2009/063112
Publication Date:
February 04, 2010
Filing Date:
July 22, 2009
Export Citation:
Assignee:
HITACHI CHEMICAL CO LTD (JP)
KUBOTA MASAO (JP)
TAKANO SHINJI (JP)
YAMADA EIICHIROU (JP)
KUBOTA MASAO (JP)
TAKANO SHINJI (JP)
YAMADA EIICHIROU (JP)
International Classes:
G03F7/027; C08F2/44; C08F12/04; C08F20/00; G03F7/004; G03F7/029; G03F7/033; G03F7/40; H05K3/06; H05K3/18
Foreign References:
| JP2006276482A | 2006-10-12 | |||
| JP2006227206A | 2006-08-31 | |||
| JP2006003435A | 2006-01-05 | |||
| JP2005121790A | 2005-05-12 |
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
Yoshiki Hasegawa (JP)
Yoshiki Hasegawa (JP)
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