PHOTOSENSITIVE ELEMENT, AND METHOD FOR FORMING RESIST PATTERN

Title:

PHOTOSENSITIVE ELEMENT, AND METHOD FOR FORMING RESIST PATTERN

Document Type and Number:

WIPO Patent Application WO/2023/238814

Kind Code:

A1

Abstract:

This photosensitive element comprises: a support body; and, on the support body, a photosensitive layer formed by using a photosensitive resin composition that contains a binder polymer, a photopolymerizable compound, a photopolymerization initiator, and a coumarin-based sensitizer, wherein the thickness of the photosensitive layer is 30 μm or more.

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Inventors:

HIRAMATSU NAOKI (JP)

Application Number:

PCT/JP2023/020769

Publication Date:

December 14, 2023

Filing Date:

June 05, 2023

Export Citation:

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Assignee:

RESONAC CORP (JP)

International Classes:

G03F7/004

Domestic Patent References:

WO2010126006A1	2010-11-04
WO2019188378A1	2019-10-03

Foreign References:

JP2019113690A	2019-07-11
JP2005128412A	2005-05-19
JP2002287349A	2002-10-03