Title:
PHOTOSENSITIVE FILM AND PHOTOSENSITIVE RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2024/070808
Kind Code:
A1
Abstract:
Provided is a photosensitive film provided with a photosensitive resin composition layer comprising a photosensitive resin composition, in which the photosensitive resin composition layer has a thickness of 20 μm or more, the photosensitive resin composition comprises (A) a polyimide precursor, (B) a compound having an ethylenically unsaturated bond, and (C) a photopolymerization initiator, and the polyimide precursor (A) contains a structural unit having a structure produced by reacting a carboxyl group in a polyamic acid structure unit produced by reacting an aliphatic acid dianhydride with a diamine compound with an epoxy group in an epoxy compound containing an ethylenically unsaturated bond.
Inventors:
MIYANAKA KENTO (JP)
OGURA ICHIRO (JP)
OGURA ICHIRO (JP)
Application Number:
PCT/JP2023/033909
Publication Date:
April 04, 2024
Filing Date:
September 19, 2023
Export Citation:
Assignee:
AJINOMOTO KK (JP)
International Classes:
G03F7/027; C08F290/14; C08G73/12; G03F7/004; H05K1/03
Foreign References:
| JP2006169409A | 2006-06-29 | |||
| JP2021015296A | 2021-02-12 | |||
| JP2004341058A | 2004-12-02 | |||
| JP2007108761A | 2007-04-26 | |||
| JP2006193691A | 2006-07-27 |
Attorney, Agent or Firm:
SAKAI INTERNATIONAL PATENT OFFICE (JP)
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