Title:
PHOTOSENSITIVE INSULATING RESIN COMPOSITION, CURED PRODUCT THEREOF AND USE THEREOF
Document Type and Number:
WIPO Patent Application WO/2006/006581
Kind Code:
A1
Abstract:
Disclosed is a photosensitive insulating resin composition which can be cured at low temperatures and enables to obtain a cured product excellent in various characteristics such as resolution, electrical insulation, impact resistance and chemical resistance. Such photosensitive insulating resin composition is suitable for the use as surface protective films and interlayer insulating films. Also disclosed are a cured product of such a photosensitive insulating resin composition and use thereof. The photosensitive insulating resin composition contains a copolymer (A) obtained by copolymerizing a (meth)acrylate having an oxetanyl group and a specific hydroxy- or alkoxy-styrene derivative, preferably a copolymer (A) obtained by copolymerizing a (meth)acrylate having an oxetanyl group, a specific hydroxy- or alkoxy-styrene derivative and an additional other vinyl monomer, a photosensitive acid generator (B), a crosslinking agent (C) and an adhesion assistant (D).
Inventors:
GOTOU HIROFUMI (JP)
INOMATA KATSUMI (JP)
IWANAGA SHIN-ICHIROU (JP)
INOMATA KATSUMI (JP)
IWANAGA SHIN-ICHIROU (JP)
Application Number:
PCT/JP2005/012806
Publication Date:
January 19, 2006
Filing Date:
July 12, 2005
Export Citation:
Assignee:
JSR CORP (JP)
GOTOU HIROFUMI (JP)
INOMATA KATSUMI (JP)
IWANAGA SHIN-ICHIROU (JP)
GOTOU HIROFUMI (JP)
INOMATA KATSUMI (JP)
IWANAGA SHIN-ICHIROU (JP)
International Classes:
C08G18/62; C08G59/40; G03F7/038; H01B3/44; (IPC1-7): G03F7/038; C08G18/62; C08G59/40; H01B3/44
Foreign References:
| JP2002229204A | 2002-08-14 | |||
| JP2004126159A | 2004-04-22 | |||
| JPH11106606A | 1999-04-20 | |||
| JPH1165116A | 1999-03-05 |
Attorney, Agent or Firm:
Suzuki, Shunichiro (Gotanda Yamazaki Bldg. 6F 13-6, Nishigotanda 7-chom, Shinagawa-ku Tokyo 31, JP)
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