Title:
PHOTOSENSITIVE RESIN COMPOSITION FOR BIOCHIP AND METHOD FOR FORMING LIQUID-REPELLENT FILM
Document Type and Number:
WIPO Patent Application WO/2017/126570
Kind Code:
A1
Abstract:
The following, inter alia, are provided: a photosensitive resin composition for biochips that, even without the execution of a PEB treatment, is capable of forming a liquid-repellent film at high resolution using an aqueous alkali solution; a method of formation; and a method for producing biochips. The photosensitive resin composition for biochips comprises the following polymer (A) or comprises the following polymer (B) and the following polymer (C) and characteristically contains 35-97 mol% of the following unit (u2) with reference to the total number of units constituting the composition. Unit (u2): unit represented by formula (II).
Polymer (A): polymer having a unit (u2) and a unit (u1) having an organic group that has at least one fluorine atom.
Polymer (B): polymer other than polymer (A) and having a unit (u1) having an organic group that has at least one fluorine atom.
Polymer (C): polymer other than polymer (A) and having a unit (u2).
(R21: hydrogen atom or methyl group; R22: alkyl group or the like; R23: hydrogen atom or the like; R24: alkyl group, cycloalkyl group, or the like)
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Inventors:
OBI MASAKI (JP)
SAKURADA TOMOAKI (JP)
TANIGUCHI TAIHEI (JP)
SASAKI MIYAKO (JP)
SAKURADA TOMOAKI (JP)
TANIGUCHI TAIHEI (JP)
SASAKI MIYAKO (JP)
Application Number:
PCT/JP2017/001602
Publication Date:
July 27, 2017
Filing Date:
January 18, 2017
Export Citation:
Assignee:
ASAHI GLASS CO LTD (JP)
International Classes:
C08F220/24; C08F220/26; C08K3/16; C08K5/42; C08L33/14; C12M1/00; G03F7/039
Foreign References:
| JP2011184517A | 2011-09-22 | |||
| JP2008297344A | 2008-12-11 | |||
| JP2008274143A | 2008-11-13 |
Attorney, Agent or Firm:
SENMYO Kenji et al. (JP)
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