Title:
PHOTOSENSITIVE RESIN COMPOSITION CONTAINING COPOLYMER
Document Type and Number:
WIPO Patent Application WO/2011/030688
Kind Code:
A1
Abstract:
Disclosed is a photosensitive resin composition that has desired characteristics. The photosensitive resin composition contains (A) a component that is a copolymer having a structural unit represented by formula (1) and at least one structural unit represented by formula (2), and (B) a component that is a photosensitizer. (In the formulae, the two Xs each independently represent a hydrogen atom, an alkyl group having 1-5 carbon atoms, a cycloalkyl group having 5 or 6 carbon atoms, a phenyl group, or a benzyl group, and Y represents a hydrogen atom, an alkyl group having 1-5 carbon atoms, a cycloalkyl group having 5 or 6 carbon atoms, a phenyl group, or a benzyl group. However, a portion or all of the hydrogen atoms in said alkyl group, said cycloalkyl group, said phenyl group, or said benzyl group may be replaced by a halogen atom, a carboxyl group, a hydroxyl group, an amino group, or a nitro group.)
Inventors:
KISHIOKA TAKAHIRO (JP)
Application Number:
PCT/JP2010/064717
Publication Date:
March 17, 2011
Filing Date:
August 30, 2010
Export Citation:
Assignee:
NISSAN CHEMICAL IND LTD (JP)
KISHIOKA TAKAHIRO (JP)
KISHIOKA TAKAHIRO (JP)
International Classes:
G03F7/023; C08F226/06; G02B1/04
Foreign References:
| JP2005353785A | 2005-12-22 | |||
| JPS62156110A | 1987-07-11 |
Other References:
See also references of EP 2479612A4
Attorney, Agent or Firm:
HANABUSA, Tsuneo et al. (JP)
Sepal Tsuneo (JP)
Sepal Tsuneo (JP)
Download PDF: