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Patent Searching and Data


Title:
PHOTOSENSITIVE RESIN COMPOSITION, CURED ARTICLE, DISPLAY DEVICE, AND METHOD FOR PRODUCING DISPLAY DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/171487
Kind Code:
A1
Abstract:
Provided is a photosensitive resin composition including a liquid-repellent material (A), an alkali-soluble resin (B), and a photosensitizer (C), wherein the liquid-repellent material (A) contains the components (A-1) and (A-2) described below. Component (A-1) is a polysiloxane containing a perfluoroalkyl group and/or a perfluoroalkylene ether group, and component (A-2) is an acrylic polymer containing a perfluoroalkyl group and/or a perfluoroalkylene ether group. The present invention makes it possible to obtain a partition wall pattern that has few defects while offering high liquid repellency on the upper surface of a partition wall and excellent ink wettability of an opening.

Inventors:
TATEMATSU YUKA (JP)
ARIMOTO SHINJI (JP)
KAMEMOTO SATOSHI (JP)
MIYOSHI KAZUTO (JP)
Application Number:
PCT/JP2023/007538
Publication Date:
September 14, 2023
Filing Date:
March 01, 2023
Export Citation:
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Assignee:
TORAY INDUSTRIES (JP)
International Classes:
G03F7/004; G03F7/075; G03F7/023; G03F7/037; H05B33/10; H05B33/12; H05B33/22; H10K50/00; H10K59/00
Domestic Patent References:
WO2020045214A12020-03-05
WO2022181350A12022-09-01
Foreign References:
JP6065915B22017-01-25
JP6418248B22018-11-07
JP2021070758A2021-05-06
JP2014156461A2014-08-28
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