Title:
PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, ELEMENT PROVIDED WITH CURED FILM, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2016/052268
Kind Code:
A1
Abstract:
To provide an alkali developable photosensitive resin composition which enables the formation of a pattern with high resolution, and which is capable of providing a cured film having excellent heat resistance and cracking resistance; and to provide a method which is capable of shortening the process required for removing a cured film of a composition after the formation of an impurity region in a semiconductor substrate, or the like, and a method for manufacturing a semiconductor device using this method.
A photosensitive resin composition which contains a polysiloxane (A), and which is characterized in that: the polysiloxane (A) is a polysiloxane represented by general formula (1); and (X) and (Y) are expressed by general formulae (4)-(6).
7.5 ≤ (X) ≤ 75 (4)
2.5 ≤ (Y) ≤ 40 (5)
1.5 × (Y) ≤ (X) ≤ 3 × (Y) (6)
Inventors:
TANIGAKI YUGO (JP)
FUJIWARA TAKENORI (JP)
FUJIWARA TAKENORI (JP)
Application Number:
PCT/JP2015/076713
Publication Date:
April 07, 2016
Filing Date:
September 18, 2015
Export Citation:
Assignee:
TORAY INDUSTRIES (JP)
International Classes:
G03F7/075; C08K3/36; C08K5/28; C08L83/06; G03F7/004; G03F7/023; G03F7/09; G03F7/40; H01L21/027; H01L21/3065
Domestic Patent References:
| WO2007049440A1 | 2007-05-03 | |||
| WO2013099785A1 | 2013-07-04 |
Foreign References:
| JP2011022173A | 2011-02-03 | |||
| JP2004059737A | 2004-02-26 | |||
| JP2010262133A | 2010-11-18 | |||
| JP2007248885A | 2007-09-27 | |||
| JP2015132814A | 2015-07-23 |
Other References:
See also references of EP 3203320A4
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