Title:
PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, PROTECTIVE FILM, INSULATING FILM AND ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2017/018290
Kind Code:
A1
Abstract:
This photosensitive resin composition is used for the purpose of forming a permanent film, and contains (A) a polyamide resin having a structure that is selected from the group consisting of polybenzoxazole structures, polybenzoxazole precursor structures, polyimide structures and polyimide precursor structures, (B) a photoacid generator, (C) an adhesion promoter and (D) an organic solvent. The organic solvent (D) contains a compound that has an ether bond and an amide bond in each molecule.
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Inventors:
OTANI SHOICHIRO (JP)
TANAKA YUMA (JP)
TANAKA YUMA (JP)
Application Number:
PCT/JP2016/071229
Publication Date:
February 02, 2017
Filing Date:
July 20, 2016
Export Citation:
Assignee:
SUMITOMO BAKELITE CO (JP)
International Classes:
G03F7/004; C08G69/26; G03F7/023; G03F7/075
Domestic Patent References:
WO2014115233A1 | 2014-07-31 |
Foreign References:
JP2007065488A | 2007-03-15 | |||
JP2006119271A | 2006-05-11 | |||
JP5672403B1 | 2015-02-18 |
Attorney, Agent or Firm:
HAYAMI Shinji (JP)
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