PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, LAMINATE, METHOD FOR MANUFACTURING CURED FILM, AND SEMICONDUCTOR DEVICE

WIPO Patent Application WO/2019/189110

A1

A photosensitive resin composition, a cured film, a laminate, a method for manufacturing a cured film, and a semiconductor device, in which: a heterocycle-containing polymer precursor, a thermal base generator, and a radically polymerizable compound are included; the heterocycle-containing polymer precursor has a radical polymerizable group; and the radically polymerizable compound includes at least one radically polymerizable compound selected from the group consisting of compounds having four or more polymerizable functional groups and compounds having three polymerizable functional groups and a molecular weight of 400 or less.

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FUKUHARA TOSHIAKI (JP)
INOUE HARUNA (JP)
YOSHIDA KENTA (JP)

PCT/JP2019/012739

October 03, 2019

March 26, 2019

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FUJIFILM CORP (JP)

G03F7/004; C08F2/48; C08G73/10; C08G73/12; G03F7/027; G03F7/031; G03F7/037; G03F7/095; G03F7/20; G03F7/32; G03F7/40; C07C225/20; C07C229/18

WO2018038002A1	2018-03-01
WO2018025738A1	2018-02-08
WO2018043467A1	2018-03-08
WO2018043262A1	2018-03-08

SIKS & CO. (JP)

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