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Title:
PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, LAMINATE, METHOD FOR PRODUCING CURED FILM, AND SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2020/066416
Kind Code:
A1
Abstract:
Provided is a photosensitive resin composition exhibiting an excellent cyclization rate and having excellent storage stability. Also provided are a cured film, a laminate, a method for producing a cured film, and a semiconductor device, each utilizing the photosensitive resin composition. The photosensitive resin composition comprises a specific thermal base generator and a precursor of a heterocyclic ring-containing polymer, wherein the specific thermal base generator has such a structure that a hydroxyl group and an amide structure (-C(=O)-N=) are linked to each other through a hydrocarbon group L, the group L has a saturated hydrocarbon group in the middle of a linking chain in the group L, and the number of atoms on the linking chain is 3 or more.

Inventors:
IWAI YU (JP)
YOSHIDA KENTA (JP)
FUKUHARA TOSHIAKI (JP)
Application Number:
PCT/JP2019/033316
Publication Date:
April 02, 2020
Filing Date:
August 26, 2019
Export Citation:
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Assignee:
FUJIFILM CORP (JP)
International Classes:
G03F7/004; C08F290/00; C08G73/10; C08G73/22; G03F7/037; G03F7/038
Domestic Patent References:
WO2018151195A12018-08-23
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See also references of EP 3859447A4
Attorney, Agent or Firm:
NAKASHIMA Junko et al. (JP)
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