Title:
PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, ELECTRONIC DEVICE PROVIDED WITH CURED FILM, AND METHOD FOR MANUFACTURING SAID DEVICE
Document Type and Number:
WIPO Patent Application WO/2020/080266
Kind Code:
A1
Abstract:
This photosensitive resin composition for forming a permanent film contains an alkali-soluble resin (A), a photosensitizer, and a solvent (C), and also contains a solvent (C-1) having a water-soluble glycol ether structure of which the boiling point is 130°C or greater.
Inventors:
KITAHATA TARO (JP)
Application Number:
PCT/JP2019/040112
Publication Date:
April 23, 2020
Filing Date:
October 10, 2019
Export Citation:
Assignee:
SUMITOMO BAKELITE CO (JP)
International Classes:
G03F7/004; G03F7/023; G03F7/20; H05K3/28
Domestic Patent References:
| WO2016031928A1 | 2016-03-03 |
Foreign References:
| JP2014071373A | 2014-04-21 | |||
| JP2014162818A | 2014-09-08 | |||
| JP2005292276A | 2005-10-20 | |||
| JP2013130816A | 2013-07-04 |
Attorney, Agent or Firm:
HAYAMI Shinji (JP)
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