PHOTOSENSITIVE RESIN COMPOSITION, CURED PRODUCT THEREOF AND PRODUCTION METHOD OF PRINTED CIRCUIT BOARD USING THE SAME

WIPO Patent Application WO2005103822

A3

There are provided a novel photosensitive resin composition, a cured film of which has ample flexibility, and which yields an insulating protective coating having superior soldering heat resistance, thermal degradation resistance and electroless gold plating resistance. The photosensitive resin composition as claimed in the present invention comprises: a photopolymerizeable component containing a urethane acrylate compound (A) and a compound (B) having an ethylenic unsaturated group other than said urethane acrylate compound (A), a thermosetting resin (C), a photopolymerization initiator (D) and a thermal polymerization catalyst (E); wherein, said urethane acrylate compound (A) is the reaction product of an isocyanate compound (a-1) of the following general formula (1): CH2=CH-COO-R-NCO (wherein, R represents a hydrocarbon group having 1 to 30 carbon atoms) with a polyhydroxy compound (a-2).

ISHIGAKI SATORU (JP)
UCHIDA HIROSHI (JP)
MIYAJIMA YOSHIO (JP)
MORINAKA KATSUTOSHI (JP)

PCT/JP2005/008100

December 14, 2006

April 21, 2005

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SHOWA DENKO KK (JP)
ISHIGAKI SATORU (JP)
UCHIDA HIROSHI (JP)
MIYAJIMA YOSHIO (JP)
MORINAKA KATSUTOSHI (JP)

G03F7/027; G03F7/038; C08F290/00; C08F299/02; C08G59/18; G03F7/00; G03F7/004; G03F7/032; G03F7/033; G03F7/035; G03F7/20; H05K3/00; H05K3/28

WO2003005126A1	2003-01-16
WO2002023273A2	2002-03-21
WO1995000573A1	1995-01-05

EP0259726A2	1988-03-16
EP1094364A1	2001-04-25
US4717643A	1988-01-05
US20020192596A1	2002-12-19
EP1035439A2	2000-09-13
US6582862B1	2003-06-24
EP0977085A1	2000-02-02

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