Title:
PHOTOSENSITIVE RESIN COMPOSITION AND CURED PRODUCT THEREOF
Document Type and Number:
WIPO Patent Application WO/2012/008472
Kind Code:
A1
Abstract:
Disclosed is a photosensitive resin composition containing a cationic photopolymerization initiator (A) and an epoxy resin (B) having two or more epoxy groups in each molecule, which is characterized in that the cationic photopolymerization initiator (A) is a cationic photopolymerization initiator (A-1) that is represented by formula (1).
Inventors:
OONISHI MISATO (JP)
IMAIZUMI NAOKO (JP)
SAKAI RYO (JP)
HONDA NAO (JP)
KIYOYANAGI TADAYUKI (JP)
IMAIZUMI NAOKO (JP)
SAKAI RYO (JP)
HONDA NAO (JP)
KIYOYANAGI TADAYUKI (JP)
Application Number:
PCT/JP2011/065923
Publication Date:
January 19, 2012
Filing Date:
July 13, 2011
Export Citation:
Assignee:
NIPPON KAYAKU KK (JP)
OONISHI MISATO (JP)
IMAIZUMI NAOKO (JP)
SAKAI RYO (JP)
HONDA NAO (JP)
KIYOYANAGI TADAYUKI (JP)
OONISHI MISATO (JP)
IMAIZUMI NAOKO (JP)
SAKAI RYO (JP)
HONDA NAO (JP)
KIYOYANAGI TADAYUKI (JP)
International Classes:
G03F7/004; C08G59/06; C08G59/68; G03F7/038; H05K3/28
Domestic Patent References:
| WO2011075553A1 | 2011-06-23 |
Foreign References:
| JP2010032991A | 2010-02-12 | |||
| JPH06184170A | 1994-07-05 | |||
| JP2009263544A | 2009-11-12 | |||
| JP2000191751A | 2000-07-11 | |||
| JP2009533377A | 2009-09-17 |
Attorney, Agent or Firm:
ASAMURA Kiyoshi et al. (JP)
Hiroshi Asamura (JP)
Hiroshi Asamura (JP)
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Claims: