PHOTOSENSITIVE RESIN COMPOSITION, CURED PRODUCT THEREOF, AND WIRING STRUCTURE CONTAINING CURED PRODUCT

WIPO Patent Application WO/2022/004285

A1

Provided are: a photosensitive resin composition; a cured product thereof; and a wiring structure, an electronic component, a semiconductor device, and a camera module containing the cured product. The photosensitive resin composition is cured by irradiation with active energy rays rather than by a heat treatment at a high temperature. This photosensitive resin composition suppresses film reduction after a development process. Furthermore, a finely detailed pattern can be accurately formed through photolithography.　One aspect of the present invention pertains a photosensitive resin composition comprising the following components (A) to (C): (A) a modified polyphenylene ether represented by formula (1) and formula (2); (B) a silsesquioxane compound represented by formula (3); and (C) a photopolymerization initiator, and said aspect also pertains to a cured product of the photosensitive resin composition, and a wiring structure, an electronic component, a semiconductor device, and a camera module containing said cured product.

CZUBAROW PAWEL (US)
OTOMO MASAYOSHI (JP)
KAPOGLIS IRMA YOLANDA (US)
KRASCO NICHOLAS CHARLES (US)
LETIZAIII FRANK ANTHONY (US)
SATO TOSHIYUKI (JP)

PCT/JP2021/021563

January 06, 2022

June 07, 2021

Click for automatic bibliography generation  

NAMICS CORP (JP)

C08F30/08; C08F299/08; G03F7/004; G03F7/027; G03F7/029; G03F7/031; G03F7/075

WO2018061988A1	2018-04-05
WO2020166288A1	2020-08-20

JP2012014021A	2012-01-19
JP2017534693A	2017-11-24
JP2017047648A	2017-03-09

IAT WORLD PATENT LAW FIRM (JP)

View/Download PDF      PDF Help

Previous Patent: POLARIZING PLATE EQUIPPED WITH RETARDATION LAYER AND ADHESIVE LAYER, AND IMAGE DISPLAY DEVICE USING ...

Next Patent: MANUFACTURING METHOD FOR POLYGLYCERIN, AND POLYGLYCERIN