Title:
PHOTOSENSITIVE RESIN COMPOSITION, CURED PRODUCT, BLACK MATRIX, AND IMAGE DISPLAY DEVICE
Document Type and Number:
WIPO Patent Application WO/2022/124296
Kind Code:
A1
Abstract:
Provided is a photosensitive resin composition having excellent fine line adhesion, adhesion stress, and suppression of pin unevenness during hot plate drying. The photosensitive resin composition according to the present invention is characterized by containing (a) an alkali-soluble resin, (b) a photopolymerizable monomer, (c) a photoinitiator, and (e) a surfactant, wherein: said (a) alkali-soluble resin includes an alkali-soluble resin (a1) having a specific partial structure; said (b) photopolymerizable monomer includes a photopolymerizable monomer (b6) having a specific partial structure; and said (e) surfactant includes a surfactant (e1) in which 0.5 mass % of propylene glycol monomethyl ether acetate solution has a surface tension of 23.0 mN/m or less at 23 °C.
Inventors:
SUNADOME TOMOKO (JP)
NAKATANI KAZUHIRO (JP)
MIYAZAKI TAKAHIRO (JP)
NOGUCHI TAKASHI (JP)
NAKATANI KAZUHIRO (JP)
MIYAZAKI TAKAHIRO (JP)
NOGUCHI TAKASHI (JP)
Application Number:
PCT/JP2021/044876
Publication Date:
June 16, 2022
Filing Date:
December 07, 2021
Export Citation:
Assignee:
MITSUBISHI CHEM CORP (JP)
International Classes:
C08F290/00; C08G59/16; G02B5/20; G03F7/004; G03F7/027
Domestic Patent References:
| WO2019004365A1 | 2019-01-03 | |||
| WO2018061525A1 | 2018-04-05 | |||
| WO2017077662A1 | 2017-05-11 | |||
| WO2021111860A1 | 2021-06-10 |
Foreign References:
| JP2017142475A | 2017-08-17 | |||
| JP2018025612A | 2018-02-15 | |||
| JP2019144543A | 2019-08-29 | |||
| JP2022022537A | 2022-02-07 |
Attorney, Agent or Firm:
TAZAKI Akira et al. (JP)
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