Title:
PHOTOSENSITIVE RESIN COMPOSITION, CURED PRODUCT, MULTILAYER BODY, METHOD FOR PRODUCING CURED PRODUCT, METHOD FOR PRODUCING MULTILAYER BODY, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/190060
Kind Code:
A1
Abstract:
The present invention provides: a photosensitive resin composition which contains a polyimide precursor that contains a repeating unit represented by formula (1), a polymerizable compound and a photopolymerization initiator; a cured product; a multilayer body; a method for producing a cured product; a method for producing a multilayer body; a method for producing a semiconductor device; and a semiconductor device.
In the formula, Z1 represents an organic group which comprises two or more ether groups and a benzene ring structure; Y1 represents an organic group; each of A1 and A2 independently represents an oxygen atom or -NRZ-; RZ represents a hydrogen atom or an organic group; each of R1 and R2 independently represents a hydrogen atom or an organic group; and at least one of R1 and R2 represents an organic group that has an ethylenically unsaturated bond.
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Inventors:
NOZAKI ATSUYASU (JP)
Application Number:
PCT/JP2023/011589
Publication Date:
October 05, 2023
Filing Date:
March 23, 2023
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
G03F7/027; C08F290/14; C08G73/12; G03F7/20; H01L21/027
Domestic Patent References:
| WO2021020344A1 | 2021-02-04 | |||
| WO2021153608A1 | 2021-08-05 |
Foreign References:
| JPH0836264A | 1996-02-06 |
Attorney, Agent or Firm:
SIKs & Co. (JP)
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