Title:
PHOTOSENSITIVE RESIN COMPOSITION, CURED PRODUCT, COLOR FILTER, AND IMAGE DISPLAY DEVICE
Document Type and Number:
WIPO Patent Application WO/2024/034608
Kind Code:
A1
Abstract:
Provided is a photosensitive resin composition which exhibits high light-scattering properties and high light transmission properties, can be developed, and exhibits high heat resistance. This photosensitive resin composition contains: resin particles (a); an alkali-soluble resin (b); and a photopolymerization initiator (c). The resin particles (a) include resin particles (a1) having a refractive index of 1.56-2.00 and an average primary particle diameter of 0.8 µm or more. The alkali-soluble resin (b) includes an alkali-soluble resin (b1) having an ethylenic double bond, and further contains at least one of a polymerization inhibitor (e) and an ultraviolet radiation absorber (f). A cured film which has a thickness of 5 µm and is obtained by curing the photosensitive resin composition has an average transmittance of 70% or more for light in the wavelength range 400-700 nm.
Inventors:
YAMAKAWA TOMOKO (JP)
Application Number:
PCT/JP2023/028923
Publication Date:
February 15, 2024
Filing Date:
August 08, 2023
Export Citation:
Assignee:
MITSUBISHI CHEM CORP (JP)
International Classes:
G03F7/004; C08F2/44; C08F2/50; C08F20/00; C08F265/04; C08F283/00; C08F291/00; G02B5/20; G03F7/027; G03F7/031; G03F7/038
Domestic Patent References:
| WO2020262271A1 | 2020-12-30 |
Foreign References:
| JP2001290021A | 2001-10-19 | |||
| JP2021039310A | 2021-03-11 | |||
| JP2009110930A | 2009-05-21 | |||
| JP2021089433A | 2021-06-10 | |||
| JP2008202042A | 2008-09-04 |
Attorney, Agent or Firm:
TAZAKI Akira et al. (JP)
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