Title:
PHOTOSENSITIVE RESIN COMPOSITION, AND DIELECTRIC INSULATING FILM AND ELECTRONIC DEVICE USING THE SAME
Document Type and Number:
WIPO Patent Application WO/2012/064074
Kind Code:
A1
Abstract:
Provided is a photosensitive resin composition having favorable photosensitivity characteristics including a resolution and a remaining rate, favorable adhesiveness to a substrate at a low exposure dose, favorable resistance to ultraviolet rays and favorable transmittance for visible rays. The photosensitive resin composition is used in an interlayer organic dielectric insulating film for a thin film transistor liquid crystal display (TFT-LCD) requiring an etching process margin, exposure margin and light resistance.
More Like This:
Inventors:
SUNG IN KYUNG (KR)
LEE MOO YOUNG (KR)
HAN SEOK (KR)
KIM SEUNG KEUN (KR)
JUNG JU YOUNG (KR)
AN SANG WANG (KR)
JANG LAE SUN (KR)
KIM JUN KI (KR)
KIM NAN SOO (KR)
LEE MOO YOUNG (KR)
HAN SEOK (KR)
KIM SEUNG KEUN (KR)
JUNG JU YOUNG (KR)
AN SANG WANG (KR)
JANG LAE SUN (KR)
KIM JUN KI (KR)
KIM NAN SOO (KR)
Application Number:
PCT/KR2011/008453
Publication Date:
May 18, 2012
Filing Date:
November 08, 2011
Export Citation:
Assignee:
ROHM & HAAS ELECT MAT (KR)
SUNG IN KYUNG (KR)
LEE MOO YOUNG (KR)
HAN SEOK (KR)
KIM SEUNG KEUN (KR)
JUNG JU YOUNG (KR)
AN SANG WANG (KR)
JANG LAE SUN (KR)
KIM JUN KI (KR)
KIM NAN SOO (KR)
SUNG IN KYUNG (KR)
LEE MOO YOUNG (KR)
HAN SEOK (KR)
KIM SEUNG KEUN (KR)
JUNG JU YOUNG (KR)
AN SANG WANG (KR)
JANG LAE SUN (KR)
KIM JUN KI (KR)
KIM NAN SOO (KR)
International Classes:
C08F2/46; C08G2/02; C08L33/10; G03F7/004; G03F7/027; G03F7/028; G03F7/033
Foreign References:
| US20100261815A1 | 2010-10-14 | |||
| US20080233515A1 | 2008-09-25 | |||
| US7267929B2 | 2007-09-11 |
Attorney, Agent or Firm:
KWON, Oh-Sig et al. (921 Dunsan-dong Seo-gu, Daejeon 302-120, KR)
Download PDF:
Claims: