Title:
PHOTOSENSITIVE RESIN COMPOSITION AND PHOTOSENSITIVE DRY FILM RESIST AND PHOTOSENSITIVE COVER RAY FILM USING THE SAME
Document Type and Number:
WIPO Patent Application WO/2002/097532
Kind Code:
A1
Abstract:
A photosensitive resin composition comprising a soluble polyimide, a compound having a carbon−carbon double bond and a photoreaction initiator and&sol or photosensitizer as main components&semi a photosensitive dry film resist using the composition&semi and a photosensitive dry film resist exhibiting excellent flame retardance. The resin composition affords a photosensitive dry film resist and a photosensitive cover ray film which exhibits good workability, can be developed with an alkaline solution, and satisfy the flame retardancy standard UL94V−0. Further, the film can be directly laminated without the use of an adhesive and is excellent in heat resistance, and thus can be suitably used as a photosensitive cover ray film for a printed board for use in electronic materials, a suspension for a hard disk, and the head portion of a hard disk in a personal computer.
Inventors:
OKADA KOJI (JP)
TAKAGAHARA KAORU (JP)
TAKAGAHARA KAORU (JP)
Application Number:
PCT/JP2002/005249
Publication Date:
December 05, 2002
Filing Date:
May 29, 2002
Export Citation:
Assignee:
KANEKA CORP (JP)
OKADA KOJI (JP)
TAKAGAHARA KAORU (JP)
OKADA KOJI (JP)
TAKAGAHARA KAORU (JP)
International Classes:
C08F2/50; C08F283/04; C08F290/04; C08F299/02; C08G73/10; G03F7/037; G03F7/075; (IPC1-7): G03F7/037; C08F2/50; C08F20/20; C08F283/04; C08F290/14; C08F299/02; C08G73/10; G03F7/004
Foreign References:
| JPH11288087A | 1999-10-19 | |||
| JPH05339373A | 1993-12-21 | |||
| EP0822229A1 | 1998-02-04 | |||
| US4656116A | 1987-04-07 | |||
| EP0755962A2 | 1997-01-29 | |||
| EP0317941A2 | 1989-05-31 | |||
| JP2001255657A | 2001-09-21 | |||
| JP2001335619A | 2001-12-04 | |||
| JP2002162740A | 2002-06-07 |
Attorney, Agent or Firm:
Kusumoto, Takayoshi (Omi-Tetsudo Bldg. 5F, 4-7, Awazu-Ch, Otsu-Shi Shiga, JP)
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