Title:
PHOTOSENSITIVE RESIN COMPOSITION, DRY FILM, CURED OBJECT, AND ELECTRONIC COMPONENT
Document Type and Number:
WIPO Patent Application WO/2020/195804
Kind Code:
A1
Abstract:
[Problem] To provide: a photosensitive resin composition which can be photocured without leaving any photocuring failure in the cured photosensitive resin composition (has excellent photocurability (in inner portions)) and which, when used as an insulating film for WLP rewiring, has hiding properties to such a degree that the wiring circuit patterns on the silicon wafer cannot be visually recognized, and in which very little internal stress occurs upon curing shrinkage; a dry film; a cured object; and an electronic component. [Solution] A photosensitive resin composition which comprises (A) a polybenzoxazole precursor, (B) a photosensitizer, and (C) an organic pigment, the organic pigment (C) being contained in an amount of 0.1-30 parts by mass per 100 parts by mass of the polybenzoxazole precursor (A), characterized by giving a cured film which has an internal stress of 20 MPa or less.
More Like This:
Inventors:
LIM YEONJEONG (JP)
AKIMOTO MAHO (JP)
AKIMOTO MAHO (JP)
Application Number:
PCT/JP2020/010391
Publication Date:
October 01, 2020
Filing Date:
March 10, 2020
Export Citation:
Assignee:
TAIYO HOLDINGS CO LTD (JP)
International Classes:
C08G73/22; G03F7/004; G03F7/023
Domestic Patent References:
| WO2017057143A1 | 2017-04-06 | |||
| WO2015046332A1 | 2015-04-02 | |||
| WO2017217292A1 | 2017-12-21 | |||
| WO2018180548A1 | 2018-10-04 |
Foreign References:
| JP2019023728A | 2019-02-14 |
Attorney, Agent or Firm:
ITOH, Atsushi (JP)
Download PDF: