Title:
PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT, METHOD FOR FORMING RESIST PATTERN, AND METHOD FOR PRODUCING SEMICONDUCTOR PACKAGE SUBSTATE OR PRINTED WIRING BOARD
Document Type and Number:
WIPO Patent Application WO/2024/009432
Kind Code:
A1
Abstract:
Provided is a photosensitive resin composition containing (A) a binder polymer, (B) a photopolymerizable compound having an ethylenically unsaturated bond, and (C) a photopolymerization initiator, wherein the photosensitivity resin composition has an absorbance for light having a wavelength of 365 nm per 1 μm thickness of 0.0041 to 0.0130 (exclusive of 0.0041).
Inventors:
KATO TETSUYA (JP)
IWASHITA KENICHI (JP)
KURODA AYAKA (JP)
ONO HIROSHI (JP)
KAGUCHI YOSUKE (JP)
TODA NATSUKI (JP)
IWASHITA KENICHI (JP)
KURODA AYAKA (JP)
ONO HIROSHI (JP)
KAGUCHI YOSUKE (JP)
TODA NATSUKI (JP)
Application Number:
PCT/JP2022/026834
Publication Date:
January 11, 2024
Filing Date:
July 06, 2022
Export Citation:
Assignee:
RESONAC CORP (JP)
International Classes:
G03F7/004
Domestic Patent References:
| WO2017018299A1 | 2017-02-02 |
Foreign References:
| JP2012234091A | 2012-11-29 |
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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