Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT, PRINTED WIRING BOARD, AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD
Document Type and Number:
WIPO Patent Application WO/2023/139682
Kind Code:
A1
Abstract:
The present disclosure relates to a photosensitive resin composition for permanent resists containing: (A) an acid-modified vinyl group-containing resin, (B) an elastomer, (C) a photoinitiator, (C) a curing agent, and (E) an inorganic filler comprising a surface-treated filler.

Inventors:
NOMOTO SHUJI (JP)
SAWAMOTO HAYATO (JP)
YAMASHITA NAOKI (JP)
Application Number:
PCT/JP2022/001765
Publication Date:
July 27, 2023
Filing Date:
January 19, 2022
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
RESONAC CORP (JP)
International Classes:
G03F7/004; G03F7/032; G03F7/038
Domestic Patent References:
WO2021157282A12021-08-12
WO2019230616A12019-12-05
Foreign References:
JP2011215392A2011-10-27
JP2011095731A2011-05-12
JP2018097140A2018-06-21
JP2020197603A2020-12-10
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
Download PDF:
View/Download PDF      PDF Help



 
Previous Patent: PROGRAM FOR PARTITIONING MULTIPLE QUBIT OBSERVABLES, METHOD FOR PARTITIONING MULTIPLE QUBIT OBSERVAB...

Next Patent: WIRELESS COMMUNICATION SYSTEM, COMMUNICATION DEVICE, COMMUNICATION CONTROL DEVICE, WIRELESS COMMUNIC...