Title:
PHOTOSENSITIVE RESIN COMPOSITION, AND PHOTOSENSITIVE ELEMENT USING SAME, AS WELL AS METHOD FOR FORMING RESIST PATTERN AND METHOD FOR PRODUCING PRINTED CIRCUIT BOARD
Document Type and Number:
WIPO Patent Application WO/2016/104585
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide a photosensitive resin composition with which it is possible to form a resist pattern having excellent resolution when the resist pattern is formed using a projection exposure technique, the present invention providing a photosensitive resin composition that contains a binder polymer (A), a photopolymerizable compound (B) having ethylenic unsaturated bonds, a photopolymerization initiator (C), a photosensitizer (D), and an polymerization inhibitor (E), the content of the polymerization inhibitor (E) being 0.03-0.3 mass parts per 100 mass parts of the total solid content of the binder polymer (A) and the photopolymerizable compound (B) having ethylenic unsaturated bonds.
Inventors:
KUME MASAKAZU (JP)
ONO HIROSHI (JP)
MUNAKATA MOMOKO (JP)
OHASHI TAKESHI (JP)
ONO HIROSHI (JP)
MUNAKATA MOMOKO (JP)
OHASHI TAKESHI (JP)
Application Number:
PCT/JP2015/085985
Publication Date:
June 30, 2016
Filing Date:
December 24, 2015
Export Citation:
Assignee:
HITACHI CHEMICAL CO LTD (JP)
International Classes:
G03F7/004; C08F2/40; C08F2/44; C08F2/50; C08F257/02; G03F7/031; H05K3/06; H05K3/18
Domestic Patent References:
| WO2010123005A1 | 2010-10-28 | |||
| WO2009078380A1 | 2009-06-25 | |||
| WO2002027407A1 | 2002-04-04 |
Foreign References:
| JP2004184878A | 2004-07-02 | |||
| JP2003066625A | 2003-03-05 | |||
| JP2005292778A | 2005-10-20 | |||
| JP2012234091A | 2012-11-29 | |||
| JP2003255329A | 2003-09-10 | |||
| JP2003029399A | 2003-01-29 | |||
| JP2002268211A | 2002-09-18 | |||
| JP2000162767A | 2000-06-16 | |||
| JP2013080194A | 2013-05-02 |
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
Yoshiki Hasegawa (JP)
Yoshiki Hasegawa (JP)
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