Title:
PHOTOSENSITIVE RESIN COMPOSITION, FILM, EPOXY COMPOUND CONTAINING BENZOCYCLOBUTENE STRUCTURE, AND USE THEREOF
Document Type and Number:
WIPO Patent Application WO/2023/246762
Kind Code:
A1
Abstract:
Embodiments of the present application provide a photosensitive resin composition, comprising a resin, a cross-linking agent, an initiator, and an epoxy compound containing a benzocyclobutene structure. According to the photosensitive resin composition provided by the embodiments of the present application, by adding the epoxy compound containing the benzocyclobutene structure, the dielectric constant and dielectric loss of a cured product obtained after the photosensitive resin composition is cured can be reduced. Moreover, the epoxy compound containing the benzocyclobutene structure can achieve better cross-linking in the curing process, to increase the crosslinking density of a final cured product, thereby improving the heat resistance and the mechanical properties of the cured product, and reducing the water absorption rate. The embodiments of the present application further provide a film prepared from the photosensitive resin composition, and uses of the photosensitive resin composition and the film.
Inventors:
LIU FULIN (CN)
TANG XINYING (CN)
MIAO JIE (CN)
QIN DEJUN (CN)
JIA BIN (CN)
TANG XINYING (CN)
MIAO JIE (CN)
QIN DEJUN (CN)
JIA BIN (CN)
Application Number:
PCT/CN2023/101334
Publication Date:
December 28, 2023
Filing Date:
June 20, 2023
Export Citation:
Assignee:
HUAWEI TECH CO LTD (CN)
MINSEOA ADVANCED MAT CO LTD (CN)
MINSEOA ADVANCED MAT CO LTD (CN)
International Classes:
G03F7/004
Foreign References:
| KR20220134911A | 2022-10-06 | |||
| CN1980984A | 2007-06-13 | |||
| CN104412163A | 2015-03-11 | |||
| US5391650A | 1995-02-21 | |||
| JP2021004933A | 2021-01-14 | |||
| JP2005062293A | 2005-03-10 |
Attorney, Agent or Firm:
SCIHEAD IP LAW FIRM (CN)
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