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Title:
PHOTOSENSITIVE RESIN COMPOSITION FOR FORMING INSULATING FILM
Document Type and Number:
WIPO Patent Application WO/2023/176259
Kind Code:
A1
Abstract:
A photosensitive resin composition for forming an insulating film, the composition comprising a solvent and at least one polymer from among polyimides, polyamic acids, and polyamic acid esters, said polymer including a photopolymerizable group, an aromatic group, and an alkyl group with 5 or more carbon atoms.

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Inventors:
HOSHINO YUKI (JP)
SAKAGUCHI TAKAHIRO (JP)
ISHII HIDENORI (JP)
ENDO TAKAFUMI (JP)
OGINO HIROSHI (JP)
Application Number:
PCT/JP2023/005180
Publication Date:
September 21, 2023
Filing Date:
February 15, 2023
Export Citation:
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Assignee:
NISSAN CHEMICAL CORP (JP)
International Classes:
G03F7/027; C08F290/14; C08G73/12; H01L21/312
Foreign References:
JP2018028694A2018-02-22
JP2021047425A2021-03-25
JP2017083880A2017-05-18
Attorney, Agent or Firm:
TAKAOKA Ryoichi et al. (JP)
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