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Title:
PHOTOSENSITIVE RESIN COMPOSITION FOR FORMING PARTITION WALLS, PARTITION WALL STRUCTURE MANUFACTURED USING SAME, AND DISPLAY DEVICE COMPRISING PARTITION WALLS
Document Type and Number:
WIPO Patent Application WO/2022/182157
Kind Code:
A1
Abstract:
The present invention relates to a photosensitive resin composition for forming partition walls, a partition wall structure manufactured using the photosensitive resin composition for forming partition walls, and a display device comprising same, the photosensitive resin composition comprising (A) a colorant, (B) an alkali-soluble resin, (C) a photopolymerizable compound, (D) a photopolymerization initiator, and (E) a solvent, wherein a cured film manufactured using the photosensitive resin composition has a transmittance of 20% or less at a wavelength of 450 nm, a reflectance of 10% or more at wavelengths of 550 nm and 650 nm, and a transmittance of 70% or more at a wavelength of 900 nm when the thickness of the cured film is 3-15 μm.

Inventors:
KWON MIN-JEONG (KR)
KIM HUN-SIK (KR)
LEE JAE-EUL (KR)
Application Number:
PCT/KR2022/002700
Publication Date:
September 01, 2022
Filing Date:
February 24, 2022
Export Citation:
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Assignee:
DONGWOO FINE CHEM CO LTD (KR)
International Classes:
G03F7/004; C08K3/013; C08K3/22; C08K3/36; C08K5/00; C08K9/02; C08K9/04; G03F7/028; G03F7/033; G03F7/105
Domestic Patent References:
WO2019194136A12019-10-10
Foreign References:
KR20170110494A2017-10-11
KR20200132843A2020-11-25
KR20200049618A2020-05-08
KR20200112626A2020-10-05
Attorney, Agent or Firm:
HANYANG PATENT FIRM (KR)
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