Title:
PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN LAMINATE, AND RESIST PATTERN FORMATION METHOD
Document Type and Number:
WIPO Patent Application WO/2023/136333
Kind Code:
A1
Abstract:
The present invention provides a photosensitive resin composition that has various improved characteristics as a result of the types and proportions of at least the acid comonomer components of the comonomer components of an alkali-soluble polymer being controlled. According to the present invention, a photosensitive resin composition includes the following components: (A) an alkali-soluble polymer; (B) a compound that has an ethylenically unsaturated bond; (C) and a photopolymerization initiator. The (A) component includes structural units derived from at least the following comonomer components: (a) methacrylic acid or acrylic acid; (b) a carboxylic acid that is different from the acid selected as the (a) component; and (c) a compound that has an aromatic structure or an alicyclic structure. The ratio (mass fraction (a1)/mass fraction (b1)) between the mass fraction (a1) of the structural units of the (A) component that are derived from the (a) component and the mass fraction (b1) of the structural units that are derived from the (b) component is 1/10–10.
Inventors:
UNO DAISUKE (JP)
SAKURAI TAKAAKI (JP)
NISHIMOTO HIDEAKI (JP)
MATSUO YUKI (JP)
SAKURAI TAKAAKI (JP)
NISHIMOTO HIDEAKI (JP)
MATSUO YUKI (JP)
Application Number:
PCT/JP2023/000842
Publication Date:
July 20, 2023
Filing Date:
January 13, 2023
Export Citation:
Assignee:
ASAHI CHEMICAL IND (JP)
International Classes:
G03F7/033; G03F7/004; G03F7/027; G03F7/029; H05K3/00
Domestic Patent References:
| WO2007080698A1 | 2007-07-19 |
Foreign References:
| JP2002023365A | 2002-01-23 | |||
| CN108287452A | 2018-07-17 |
Attorney, Agent or Firm:
AOKI, Atsushi et al. (JP)
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