PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN LAYER MANUFACTURED USING SAME, AND COLOR FILTER

Title:

PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN LAYER MANUFACTURED USING SAME, AND COLOR FILTER

Document Type and Number:

WIPO Patent Application WO/2024/043429

Kind Code:

A1

Abstract:

The present invention relates to a photosensitive resin composition, a photosensitive resin layer manufactured using same, and a color filter. Specifically, one embodiment of the present invention provides a photosensitive resin composition comprising: (A) a photopolymerizable compound; (B) a colorant; (C) a binder resin; (D) a photopolymerization initiator; and (E) a solvent, wherein the photopolymerizable compound is a compound having a refractive index at 20°C of more than 1.577.

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Inventors:

KIM IEJU (KR)
LEE YOUNG (KR)
CHO MYUNGHO (KR)

Application Number:

PCT/KR2023/005402

Publication Date:

February 29, 2024

Filing Date:

April 20, 2023

Export Citation:

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Assignee:

SAMSUNG SDI CO LTD (KR)

International Classes:

G03F7/004; C08F2/44; C08F2/50; G02B5/20; G03F7/00; G03F7/028; G03F7/033; G03F7/105; H01L27/146

Foreign References:

KR20130060772A	2013-06-10
KR101702883B1	2017-02-08
CN113388059A	2021-09-14
KR20160062829A	2016-06-03
US20160122578A1	2016-05-05

Attorney, Agent or Firm:

PANKOREA PATENT AND LAW FIRM (KR)

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