PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN LAYER USING THE SAME AND COLOR FILTER

WIPO Patent Application WO/2024/048894

A1

The present description relates to a photosensitive resin composition, a photosensitive resin film prepared by using same, and a color filter. An embodiment provides a photosensitive resin composition comprising: (A) a coloring agent; (B) a photopolymerizable compound; (c) a photopolymerization initiator; and (D) a solvent, wherein the photopolymerizable compound comprises: as a first polymerizable compound, dipentaerythritol hexa(meta)acrylate; and as a second polymerizable compound, alkoxylated dipentaerythritol poly(meta)acrylate, dendritic polyester (meta)acrylate, or a combination thereof.

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KIM NAMHOON (KR)
JEON YOUNGMIN (KR)
PARK SOOYEON (KR)
KIM JIEUN (KR)
KWON JIHYE (KR)
KWON HYUKSIN (KR)
PARK EUNBI (KR)
PARK DONGHYUN (KR)
PARK BAEK SOUNG (KR)

PCT/KR2023/005590

March 07, 2024

April 25, 2023

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SAMSUNG SDI CO LTD (KR)

G03F7/004; C08F2/38; C08F2/44; C08F2/50; G02B5/20; G03F7/00; G03F7/028; G03F7/033; G03F7/105

KR20160115094A	2016-10-06
JP2007310025A	2007-11-29
KR20160142672A	2016-12-13
KR20170101263A	2017-09-05
US20080081124A1	2008-04-03

PANKOREA PATENT AND LAW FIRM (KR)

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