Title:
PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE MATERIAL, DISPLAY DEVICE, AND METHOD FOR LOW-TEMPERATURE CURING OF PHOTOSENSITIVE RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2020/101345
Kind Code:
A1
Abstract:
The present specification provides: a photosensitive resin composition comprising a binder bearing an epoxy group, and an additive bearing a thiol group and a siloxane; a photosensitive material; a display device; and a method for low-temperature curing of a photosensitive resin composition.
Inventors:
KWON OH TAK (KR)
LEE SOOHEE (KR)
CHOI A NAM (KR)
NOH BYEONG IL (KR)
LEE SOOHEE (KR)
CHOI A NAM (KR)
NOH BYEONG IL (KR)
Application Number:
PCT/KR2019/015440
Publication Date:
May 22, 2020
Filing Date:
November 13, 2019
Export Citation:
Assignee:
LG CHEMICAL LTD (KR)
International Classes:
C08F212/08; G03F7/075; C08F220/18; C08F220/32; C08G77/18; C08G77/20; C08G77/28; C08G77/392; C08L33/06; C08L83/04
Foreign References:
| KR20140042163A | 2014-04-07 | |||
| KR20180067243A | 2018-06-20 | |||
| KR20140146008A | 2014-12-24 | |||
| KR20150033793A | 2015-04-02 | |||
| JP2017049566A | 2017-03-09 |
Attorney, Agent or Firm:
CHUNG, Soon-Sung (KR)
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