Title:
PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN MEMBRANE, PHOTOSENSITIVE DRY FILM, PATTERN FORMATION METHOD, AND LIGHT-EMITTING ELEMENT
Document Type and Number:
WIPO Patent Application WO/2024/075585
Kind Code:
A1
Abstract:
The present invention provides a photosensitive resin composition which contains (A) a silicone resin having a glycidyl group, (B) a photo-cationic polymerization initiator, and (C) quantum dots, and which is characterized in that the quantum dots have a surface coating layer containing a siloxane. As a result, provided are: a photosensitive resin composition from which a membrane having high lithographic resolution and favorable light-emitting characteristics can be easily formed; a photosensitive resin membrane obtained by using said photosensitive resin composition; a photosensitive dry film; a pattern formation method using said photosensitive dry film; and a light-emitting element obtained by using said photosensitive resin composition.
Inventors:
MARUYAMA HITOSHI (JP)
AOKI SHINJI (JP)
NOJIMA YOSHIHIRO (JP)
TOBISHIMA KAZUYA (JP)
AOKI SHINJI (JP)
NOJIMA YOSHIHIRO (JP)
TOBISHIMA KAZUYA (JP)
Application Number:
PCT/JP2023/034847
Publication Date:
April 11, 2024
Filing Date:
September 26, 2023
Export Citation:
Assignee:
SHINETSU CHEMICAL CO (JP)
International Classes:
G03F7/075; B82Y20/00; C08G59/20; C08G77/48; G03F7/004
Attorney, Agent or Firm:
YOSHIMIYA Mikio et al. (JP)
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