Title:
PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR MANUFACTURING PATTERN-CURED PRODUCT, CURED PRODUCT, INTERLAYER INSULATION FILM, COVER COAT LAYER, SURFACE PROTECTION FILM, AND ELECTRONIC COMPONENT
Document Type and Number:
WIPO Patent Application WO/2020/071437
Kind Code:
A1
Abstract:
A photosensitive resin composition containing: (A) a polyimide precursor having a polymerizable unsaturated bond; (B) a polymerizable monomer; (C) a photopolymerization initiator; (D) a cyclization catalyst; and (E) a solvent.
Inventors:
YONEDA SATOSHI (JP)
ASADA AKIRA (JP)
SOEJIMA KAZUYA (JP)
MATSUIE NORITAKA (JP)
ENOMOTO TETSUYA (JP)
ASADA AKIRA (JP)
SOEJIMA KAZUYA (JP)
MATSUIE NORITAKA (JP)
ENOMOTO TETSUYA (JP)
Application Number:
PCT/JP2019/038959
Publication Date:
April 09, 2020
Filing Date:
October 02, 2019
Export Citation:
Assignee:
HITACHI CHEMICAL DUPONT MICROSYSTEMS LTD (JP)
International Classes:
G03F7/004; C08G73/12; G03F7/027; G03F7/031; G03F7/20; G03F7/40
Domestic Patent References:
| WO2017110982A1 | 2017-06-29 | |||
| WO2018135370A1 | 2018-07-26 |
Foreign References:
| JP2017021113A | 2017-01-26 | |||
| JP2007328363A | 2007-12-20 | |||
| JP2018084626A | 2018-05-31 | |||
| JP2004133435A | 2004-04-30 |
Attorney, Agent or Firm:
HEIWA INTERNATIONAL PATENT OFFICE (JP)
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