PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING CURED FILM, CURED FILM, ORGANIC EL DISPLAY DEVICE AND LIQUID CRYSTAL DISPLAY DEVICE

WIPO Patent Application WO/2014/020984

A1

Provided is a photosensitive resin composition which has excellent sensitivity, storage stability and heat-resistant transparency. This photosensitive resin composition contains (A) a polymer component which contains a polymer that satisfies (1) and/or (2) described below, (B) a compound represented by formula (I), and (C) a solvent. (1) a polymer which has (a1) a constituent unit having a group wherein an acid group is protected with an acid-decomposable group and (a2) a constituent unit having a crosslinkable group (2) (a1) a polymer which has a constituent unit having a group wherein an acid group is protected with an acid-decomposable group, and (a2) a polymer which has a constituent unit having a crosslinkable group AA General formula (I)

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JP2013140379	PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE FILM, METHOD OF MANUFACTURING PERMANENT MASK RESIST, AND PERMANENT MASK RESIST

SAKITA KYOUHEI (JP)
FUJIMOTO SHINJI (JP)
NAKAGAWA MIKIO (JP)
YAMAZAKI KENTA (JP)

PCT/JP2013/065324

February 06, 2014

June 03, 2013

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FUJIFILM CORP (JP)

G03F7/004; C07D263/56; C07D263/60; C07D277/64; C07D277/84; C08F12/22; C08F20/26; G02F1/1368; G03F7/039; G03F7/40; H01L51/50; H05B33/22

JP2012133211A	2012-07-12
JPS5749669A	1982-03-23
JP2001227106A	2001-08-24

SIKs & Co. (JP)
Patent business corporation patent firm Sykes (JP)

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