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Title:
PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING CURED FILM, CURED FILM, LIQUID CRYSTAL DISPLAY DEVICE AND ORGANIC EL DISPLAY DEVICE
Document Type and Number:
WIPO Patent Application WO/2015/037695
Kind Code:
A1
Abstract:
Provided are: a photosensitive resin composition which exhibits good adhesion; a method for producing a cured film; a cured film; a liquid crystal display device; and an organic EL display device. A photosensitive resin composition which contains (A-1) a polymer component containing a polymer that falls under the category of (1) and/or (2) described below, (B-1) a photoacid generator, (C-1) a solvent and (S) a polymer containing a constituent unit having a partial structure represented by general formula (1) and a constituent unit having at least one group (X) that is selected from the group consisting of an epoxy group, a mercapto group, a (meth)acryloyl group, a vinyl group and an amino group. (1) a polymer having (a1-1) a constituent unit having a group wherein an acid group is protected by an acid-decomposable group and (a1-2) a constituent unit having a crosslinkable group (2) a polymer having (a1-1) a constituent unit having a group wherein an acid group is protected by an acid-decomposable group and a polymer having (a1-2) a constituent unit having a crosslinkable group

Inventors:
YONEZAWA HIROYUKI (JP)
Application Number:
PCT/JP2014/074171
Publication Date:
March 19, 2015
Filing Date:
September 12, 2014
Export Citation:
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Assignee:
FUJIFILM CORP (JP)
International Classes:
G03F7/075; G02F1/1333; G03F7/023; G03F7/033; G03F7/039; G03F7/40; H01L51/50; H05B33/22
Domestic Patent References:
WO2011136073A12011-11-03
Foreign References:
JP2010282177A2010-12-16
JP2012159830A2012-08-23
JP2013210558A2013-10-10
JP2009168992A2009-07-30
JP2008176037A2008-07-31
JP2009169343A2009-07-30
JP2008242438A2008-10-09
JP2012083387A2012-04-26
JP2013064973A2013-04-11
JP2013160825A2013-08-19
JP2006337567A2006-12-14
Attorney, Agent or Firm:
SIKs & Co. (JP)
Patent business corporation patent firm Sykes (JP)
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