Title:
PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING PATTERN CURED PRODUCT, CURED PRODUCT, INTERLAYER INSULATING FILM, COVER-COAT LAYER, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT
Document Type and Number:
WIPO Patent Application WO/2018/181893
Kind Code:
A1
Abstract:
Provided is a photosensitive resin composition containing (A) a polyimide precursor having a polymerizable unsaturated bond, (B) a polymerizable monomer having an alicyclic skeleton, (C) a photopolymerization initiator, and (D) a solvent.
Inventors:
TSUCHIYA ETSUHARU (JP)
ENOMOTO TETSUYA (JP)
KAWAMORI TAKASHI (JP)
SAITO NOBUYUKI (JP)
KOIBUCHI YUKARI (JP)
YOSHIZAWA ATSUTARO (JP)
ASADA AKIRA (JP)
ENOMOTO TETSUYA (JP)
KAWAMORI TAKASHI (JP)
SAITO NOBUYUKI (JP)
KOIBUCHI YUKARI (JP)
YOSHIZAWA ATSUTARO (JP)
ASADA AKIRA (JP)
Application Number:
PCT/JP2018/013598
Publication Date:
October 04, 2018
Filing Date:
March 30, 2018
Export Citation:
Assignee:
HITACHI CHEMICAL DUPONT MICROSYSTEMS LTD (JP)
International Classes:
G03F7/027; G03F7/004
Domestic Patent References:
| WO2015052885A1 | 2015-04-16 | |||
| WO2015199219A1 | 2015-12-30 |
Foreign References:
| JP2016199662A | 2016-12-01 | |||
| JP2004133435A | 2004-04-30 | |||
| JP2016086000A | 2016-05-19 |
Attorney, Agent or Firm:
HEIWA INTERNATIONAL PATENT OFFICE (JP)
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