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Title:
PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING PATTERNED CURED PRODUCT, CURED PRODUCT, INTERLAYER INSULATING FILM, COVER COAT LAYER, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT
Document Type and Number:
WIPO Patent Application WO/2020/071201
Kind Code:
A1
Abstract:
This photosensitive resin composition contains (A) a polyimide precursor, (B) a polymerizable monomer, (C) a photopolymerization initiator, (D) an antirust agent, (E) an antioxidant, (F) a cyclization catalyst, and (G) a solvent.

Inventors:
MATSUIE NORITAKA (JP)
YONEDA SATOSHI (JP)
ENOMOTO TETSUYA (JP)
Application Number:
PCT/JP2019/037558
Publication Date:
April 09, 2020
Filing Date:
September 25, 2019
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Assignee:
HITACHI CHEMICAL DUPONT MICROSYSTEMS LTD (JP)
International Classes:
G03F7/004; C08F2/48; C08G73/10; G03F7/027; G03F7/20; G03F7/32; G03F7/40
Domestic Patent References:
WO2013168675A12013-11-14
Foreign References:
JP2011191749A2011-09-29
JP2016167036A2016-09-15
JP2018084626A2018-05-31
JP2016199662A2016-12-01
Attorney, Agent or Firm:
HEIWA INTERNATIONAL PATENT OFFICE (JP)
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