Title:
PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING PATTERNED CURED FILM, PATTERNED CURED FILM AND SEMICONDUCTOR ELEMENT
Document Type and Number:
WIPO Patent Application WO/2021/261448
Kind Code:
A1
Abstract:
The present disclosure relates to: a photosensitive resin composition which contains (A) an alkali-soluble resin that has an imide bond and a phenolic hydroxyl group, and (B) a compound which generates an acid by means of light; a patterned cured film which is obtained using this photosensitive resin composition; a method for producing a patterned cured film; and a semiconductor element.
Inventors:
AOKI YU (JP)
HAMANO YOSHIMI (JP)
SUZUKI TERUAKI (JP)
HASHIMOTO MASAHIRO (JP)
HAMANO YOSHIMI (JP)
SUZUKI TERUAKI (JP)
HASHIMOTO MASAHIRO (JP)
Application Number:
PCT/JP2021/023418
Publication Date:
December 30, 2021
Filing Date:
June 21, 2021
Export Citation:
Assignee:
SHOWA DENKO MATERIALS CO LTD (JP)
International Classes:
G03F7/004; G03F7/023; G03F7/037
Domestic Patent References:
| WO2019065351A1 | 2019-04-04 | |||
| WO2010073948A1 | 2010-07-01 |
Foreign References:
| JP2018111773A | 2018-07-19 | |||
| JP2020094194A | 2020-06-18 | |||
| JP2018054937A | 2018-04-05 | |||
| JP2014102285A | 2014-06-05 | |||
| JP2018185480A | 2018-11-22 | |||
| JP2008309885A | 2008-12-25 | |||
| JP2007057595A | 2007-03-08 | |||
| JP2016024306A | 2016-02-08 |
Other References:
J. PHOTOPOLYM. SCI. TECHNOL, vol. 18, 2005, pages 327 - 332
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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