Title:
PHOTOSENSITIVE RESIN COMPOSITION, AND METHOD FOR PRODUCING PHOTOSENSITIVE RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2022/124052
Kind Code:
A1
Abstract:
The photosensitive resin composition according to the present invention contains a resin (A), a reactive diluent (B), a solvent (C), a photopolymerization initiator (D), and a colorant (E). The resin (A) has a structural unit (a) having an aromatic ring skeleton, a structural unit (b) having a carboxy group, a structural unit (c), and a structural unit (d) having a bridging alicyclic hydrocarbon group having 7-20 carbon atoms, wherein the structural unit (c) is at least one unit selected from the group consisting of a structural unit (c-1) having a (meth) acryloyloxy group and a structural unit (c-2) having a functional group that reacts with a carboxy group. The photosensitive resin composition is characterized in that the content of the structural unit (a) having an aromatic ring skeleton is 5-50 mol% with respect to the total amount of the structural units of the resin (A).
Inventors:
HAYASHI SHUNSUKE (JP)
KINOSHITA TAKEHIRO (JP)
KINOSHITA TAKEHIRO (JP)
Application Number:
PCT/JP2021/042587
Publication Date:
June 16, 2022
Filing Date:
November 19, 2021
Export Citation:
Assignee:
SHOWA DENKO KK (JP)
International Classes:
G03F7/004; G02B5/20; G03F7/027
Domestic Patent References:
| WO2017204079A1 | 2017-11-30 |
Attorney, Agent or Firm:
OIKAWA Shu et al. (JP)
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