Title:
PHOTOSENSITIVE RESIN COMPOSITION FOR MICROLENS
Document Type and Number:
WIPO Patent Application WO/2011/024545
Kind Code:
A1
Abstract:
Disclosed is a photosensitive resin composition for a microlens.
The photosensitive resin composition for a microlens comprises the following components (A), (B) and (C): (A) a polymer having a maleimide structure unit represented by formula (1); (B) a cross-linking agent; and (C) a photosensitizing agent.
Inventors:
KISHIOKA TAKAHIRO (JP)
SAKAGUCHI TAKAHIRO (JP)
SAKAGUCHI TAKAHIRO (JP)
Application Number:
PCT/JP2010/060476
Publication Date:
March 03, 2011
Filing Date:
June 21, 2010
Export Citation:
Assignee:
NISSAN CHEMICAL IND LTD (JP)
KISHIOKA TAKAHIRO (JP)
SAKAGUCHI TAKAHIRO (JP)
KISHIOKA TAKAHIRO (JP)
SAKAGUCHI TAKAHIRO (JP)
International Classes:
G02B1/04; C08F22/40; C08L35/00; G02B3/00; G03F7/004; G03F7/023
Domestic Patent References:
| WO2005116764A1 | 2005-12-08 | |||
| WO2002083764A1 | 2002-10-24 |
Foreign References:
| JP2009179770A | 2009-08-13 | |||
| JP2009157038A | 2009-07-16 | |||
| JP2009003366A | 2009-01-08 | |||
| JP2002341137A | 2002-11-27 | |||
| JP2003026942A | 2003-01-29 | |||
| US6586560B1 | 2003-07-01 | |||
| JPH0623842B2 | 1994-03-30 | |||
| JP2008303315A | 2008-12-18 | |||
| JP2002032377A | 2002-01-31 | |||
| JP2003131375A | 2003-05-09 | |||
| JP2004224894A | 2004-08-12 | |||
| JP2001354822A | 2001-12-25 |
Other References:
See also references of EP 2472293A4
Attorney, Agent or Firm:
HANABUSA, Tsuneo et al. (JP)
Sepal Tsuneo (JP)
Sepal Tsuneo (JP)
Download PDF: