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Title:
PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN MULTILAYER BODY, AND METHOD FOR FORMING RESIST PATTERN
Document Type and Number:
WIPO Patent Application WO/2024/085254
Kind Code:
A1
Abstract:
The present disclosure relates to a photosensitive resin composition, a photosensitive resin multilayer body, and a method for forming a resist pattern. This photosensitive resin composition contains the following components: (A) an alkali-soluble polymer; (B) a compound having an ethylenically unsaturated double bond; (C) a polymerization initiator; and (D) a boron compound that absorbs h-rays and/or i-rays.

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Inventors:
KAMEYAMA NAO (JP)
NISHIMOTO HIDEAKI (JP)
MATSUMOTO KATSUHISA (JP)
MATSUO YUKI (JP)
Application Number:
PCT/JP2023/038065
Publication Date:
April 25, 2024
Filing Date:
October 20, 2023
Export Citation:
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Assignee:
ASAHI CHEMICAL IND (JP)
International Classes:
G03F7/029; G03F7/004; G03F7/027; G03F7/033; G03F7/11; G03F7/20; H05K3/06; H05K3/18
Domestic Patent References:
WO2022186389A12022-09-09
Foreign References:
JPH04172456A1992-06-19
JP2022136141A2022-09-15
Attorney, Agent or Firm:
AOKI, Atsushi et al. (JP)
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