Title:
PHOTOSENSITIVE RESIN COMPOSITION AND ORGANIC EL ELEMENT PARTITION WALL
Document Type and Number:
WIPO Patent Application WO/2022/220080
Kind Code:
A1
Abstract:
Provided is a high-sensitivity photosensitive resin composition which contains a black colorant and by which development and pattern formation are possible even at low amounts of light exposure. This photosensitive resin composition comprises: (A) a binder resin; (B1) a first quinone diazide adduct, which is a quinone diazide adduct to a first phenol compound; (B2) a second quinone diazide adduct, which is a quinone diazide adduct to a second phenol compound; and (C) a black colorant. The difference between the molecular weight of the first phenol compound and the molecular weight of the second phenol compound is 40-500. The molecular weight of the first phenol compound is smaller than the molecular weight of the second phenol compound.
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Inventors:
ARAI YOSHIKAZU (JP)
Application Number:
PCT/JP2022/014606
Publication Date:
October 20, 2022
Filing Date:
March 25, 2022
Export Citation:
Assignee:
SHOWA DENKO KK (JP)
International Classes:
G03F7/004; G03F7/022; G03F7/023; G03F7/039; H01L51/50; H05B33/02; H05B33/12; H05B33/22
Domestic Patent References:
| WO2017069172A1 | 2017-04-27 | |||
| WO2018186494A1 | 2018-10-11 |
Foreign References:
| JP2005266189A | 2005-09-29 | |||
| JP2004002753A | 2004-01-08 |
Attorney, Agent or Firm:
AOKI, Atsushi et al. (JP)
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