Title:
PHOTOSENSITIVE RESIN COMPOSITION, PATTERNED CURED FILM AND PRODUCTION METHOD THEREFOR, SEMICONDUCTOR ELEMENT, AND ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2020/183617
Kind Code:
A1
Abstract:
This photosensitive resin composition contains an alkali-soluble resin, a nadiimide compound that is represented by formula (1), a thermal crosslinking agent, and a compound that generates an acid by means of light. In formula (1), each R11 independently indicates an allyl group, m is 0 or 1, and R12 indicates a divalent organic group.
Inventors:
AOKI YU (JP)
HAMANO YOSHIMI (JP)
KOMINE TAKUYA (JP)
HASHIMOTO MASAHIRO (JP)
HAMANO YOSHIMI (JP)
KOMINE TAKUYA (JP)
HASHIMOTO MASAHIRO (JP)
Application Number:
PCT/JP2019/010057
Publication Date:
September 17, 2020
Filing Date:
March 12, 2019
Export Citation:
Assignee:
HITACHI CHEMICAL CO LTD (JP)
International Classes:
G03F7/004; G03F7/022; G03F7/20
Domestic Patent References:
| WO2008123053A1 | 2008-10-16 | |||
| WO2009145153A1 | 2009-12-03 |
Foreign References:
| JP2017187752A | 2017-10-12 | |||
| JP2011013644A | 2011-01-20 | |||
| JP2004062142A | 2004-02-26 |
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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