Title:
PHOTOSENSITIVE RESIN COMPOSITION FOR PHOTO SPACER, AND PHOTO SPACER
Document Type and Number:
WIPO Patent Application WO/2014/038576
Kind Code:
A1
Abstract:
A photosensitive resin composition for a photo spacer is provided which exhibits excellent substrate adhesion properties, which is capable of forming a photo spacer exhibiting excellent elastic recovery and breaking strength, and with which little development residue is generated. This photosensitive resin composition for a photo spacer includes an acrylic resin as a binder polymer, said acrylic resin having repeating moieties having a ring structure in the main chain thereof, and repeating moieties having at least two oxyalkylene groups in a branched chain thereof. In one embodiment of the present invention, this photosensitive resin composition for a photo spacer further includes: a multifunctional monomer; a first photopolymerization initiator having a maximum absorption wavelength in the range of 290nm-380nm; and a second photopolymerization initiator having a maximum absorption wavelength in the range of 230nm-290-nm.
Inventors:
TANAKA SHINSUKE (JP)
KAHARA KOJI (JP)
MINATOBE YUTA (JP)
KAHARA KOJI (JP)
MINATOBE YUTA (JP)
Application Number:
PCT/JP2013/073765
Publication Date:
March 13, 2014
Filing Date:
September 04, 2013
Export Citation:
Assignee:
NIPPON CATALYTIC CHEM IND (JP)
International Classes:
G03F7/038; C08F220/26; C08F220/28; C08F222/40; G02F1/1339
Foreign References:
JP2010014937A | 2010-01-21 | |||
JP2009168992A | 2009-07-30 | |||
JP2010107693A | 2010-05-13 | |||
JP2011002694A | 2011-01-06 | |||
JP2005091852A | 2005-04-07 | |||
JP2011157478A | 2011-08-18 |
Attorney, Agent or Firm:
MOMII, Takafumi (JP)
Takafumi Momii (JP)
Takafumi Momii (JP)
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