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Title:
PHOTOSENSITIVE RESIN COMPOSITION, PIGMENT DISPERSION, CURED PRODUCT, BLACK MATRIX, AND IMAGE DISPLAY DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/176899
Kind Code:
A1
Abstract:
Provided is a photosensitive resin composition that exhibits excellent linearity in a pattern formed thereby and excellent fine line characteristics, and in which the generation of foreign matter originating from a pigment is suppressed. A photosensitive resin composition according to the present invention contains (A) a pigment, (B) a dispersant, (D) an alkali-soluble resin, (E), a photopolymerizable compound, and (F) a photopolymerization initiator. The (A) pigment has an average primary particle size of 15-28 nm and contains carbon black (a1) with a dibutyl phthalate absorption of 55-100 mL/100 g. The specific surface area of the carbon black (a1) as measured by the BET method is 105 m2/g or less. The value of Z derived from formula (1) is 15 or more, where X is the average primary particle size (nm) of the carbon black (a1) and Y is the dibutyl phthalate absorption (mL/100 g). Formula (1): Y - 1.6X = Z

Inventors:
ISHII HIROAKI (JP)
RIKITAKE NOBUO (JP)
IRIKI KENICHI (JP)
FUJIMOTO SHOU (JP)
Application Number:
PCT/JP2023/010154
Publication Date:
September 21, 2023
Filing Date:
March 15, 2023
Export Citation:
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Assignee:
MITSUBISHI CHEM CORP (JP)
International Classes:
G03F7/004; G02B5/20; G02F1/1335; G03F7/027
Domestic Patent References:
WO2020162270A12020-08-13
Foreign References:
JP2021177204A2021-11-11
JP2014102346A2014-06-05
JP2019082533A2019-05-30
Attorney, Agent or Firm:
TAZAKI Akira et al. (JP)
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