Title:
PHOTOSENSITIVE RESIN COMPOSITION AND PRINTED WIRING BOARD PRODUCTION METHOD
Document Type and Number:
WIPO Patent Application WO/2023/190454
Kind Code:
A1
Abstract:
[Problem] To provide a photosensitive resin composition having preferable characteristics required during printed wiring board production, wherein crystallization of a component is suppressed even when exposed to an environment under which an ordinary temperature condition and a low temperature condition are repeated. [Solution] This photosensitive resin composition comprises a carboxy group-containing resin, a photopolymerization initiator, and an organic solvent, wherein an α-aminoacetophenone-based photopolymerization initiator is blended as the photopolymerization initiator, and a petroleum-based solvent, a carbitol acetate, and dipropylene glycol monomethyl ether are blended as the organic solvent.
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Inventors:
SUTO DAISAKU (JP)
FUKUDA SHINICHIRO (JP)
OKAMOTO DAICHI (JP)
SHIMURA MASAYUKI (JP)
FUKUDA SHINICHIRO (JP)
OKAMOTO DAICHI (JP)
SHIMURA MASAYUKI (JP)
Application Number:
PCT/JP2023/012393
Publication Date:
October 05, 2023
Filing Date:
March 28, 2023
Export Citation:
Assignee:
TAIYO HOLDINGS CO LTD (JP)
International Classes:
G03F7/004; G03F7/031; H05K3/28
Domestic Patent References:
| WO2014002294A1 | 2014-01-03 |
Foreign References:
| JP2019174788A | 2019-10-10 | |||
| JP2019179201A | 2019-10-17 | |||
| JP2017003967A | 2017-01-05 | |||
| JP2014235376A | 2014-12-15 | |||
| JP2008116813A | 2008-05-22 | |||
| JP2016065942A | 2016-04-28 | |||
| JP2016027363A | 2016-02-18 |
Attorney, Agent or Firm:
MIYAJIMA Manabu et al. (JP)
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